SYS-E300-13AD

Details that matter

Engineered for professionals who demand the best in performance, security, and design.

13th/12th Gen Intel® Core™ (LGA-1700)

13th/12th Generation Intel® Core™ i9/i7/i5/i3/Pentium/Celeron Processor (LGA-1700)

Intel® Q670E Chipset

Intel® Q670E

Up to 64GB DDR4-3200 Memory

2x DDR4-3200MHz SO-DIMM max 64GB

M.2 M/E-Key & PCIe 5.0 x16 Slot

Support M.2 M/E-Key
Support 1x PCIe 5.0 x16 Slot (Optional)

AMT vPro Supported

Up to 2x 2.5" Drive Bays (Optional)

Support up to 2x 2.5" drive bays (Optional)

Quad Independent Displays

Quad Independent Display by 2x HDMI and 2x DP

Key Applications

Healthcare, Surveillance Security Server, AI Inference, Digital Signage / PoS

Technical Specifications

Full specifications for the model

SKU	SYS-E300-13AD
Motherboard	Super X13SAV-LVDS
Cpu	Single LGA-1700 13th/12th Gen Intel® Core i9/Core i7/Core i5/Core i3/Pentium/Celeron processor
Core Count	Up to 16C/32T; Up to 30MB Cache
Cpu Note	Supports up to 65W TDP CPUs (Air Cooled)
Max Gpu Count	1 single-width GPU
Supported Gpu	NVIDIA PCIe: A1000, L4 NVIDIA: RTX A400
Memory	Slot Count: 2 DIMM slots Max Memory (2DPC): Up to 64GB 3200MT/s non-ECC DDR4 SO-DIMM
Memory Voltage	1.2V
Chipset	Intel® Q670E
Network Connectivity	1 RJ45 1GbE with Intel® I210-AT 1 RJ45 2.5GbE with Intel® I225-LM
Lan	1 RJ45 2.5 GbE LAN port (Intel® I225-LM) 1 RJ45 1 GbE LAN port (Intel® I210-AT)
Usb	4 USB 3.2 Gen2 Type-A ports (Rear)
Video	1 HDMI® 2.0b port(s) (Rear) 1 HDMI® 1.4 port(s) (Rear) 2 DisplayPort ports (Rear)
Audio	Line Out Mic in
Bios Type	AMI 32MB SPI Flash
Bios Features	ACPI 6.0 Plug and Play (PnP) RTC (Real Time Clock) Wakeup SPI dual/quad speed support
Management Software	SuperCloud Composer® (SCC) Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power Configurations	Power-on mode for AC power recovery ACPI Power Management
Security Hardware	Trusted Platform Module (TPM) 2.0
Operating Systems	RHEL 8.6, Windows 10
Form Factor	Fan-based Embedded
Chassis Model	CSE-E300
Height	1.69" (43 mm)
Width	10.43" (264.8 mm)
Depth	8.89" (225.8 mm)
Package	10.87" (H) x 15" (W) x 5.59" (D)
Weight	Gross Weight: 7.5 lbs (3.4 kg) Net Weight: 3.7 lbs (1.6 kg)
Palletized Packing	54.33" (1380 mm) x 78.5" (1993 mm) x 35" (890 mm)
Available Color	Black
Front Panel Buttons	Power On/Off
Front Panel Led	HDD Status LAN1 activity LAN2 activity Power status WIFI activity
Pcie Configuration	Default* 1 PCIe 5.0 x16 (in x16) LP slot 1 PCIe 5.0 x16 (in x16) LP slot (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
Expansion M 2	1 M.2 PCIe 3.0 x1 slot (E-key 2230)
Drive Bays Configuration	Default: Total 1 bay 1 internal fixed 2.5" SATA* drive bay 1 internal fixed 2.5" SATA* drive bay (*SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
M 2	1 M.2 PCIe 4.0 x4 NVMe slot (M-key 2280)
Fans	Up to 2x 4-PIN PWM 40x40x28mm Fan(s) Up to 1 CPU heatsink with Φ80x15mm Fan(s)
Power Supply Dimension Wxhxl	151.3 x 25.4 x 75.6 mm
Power Supply Input	180W: 100-240Vac / 47-63Hz
Environmental Spec	Operating Temperature: 0°C to 40°C (32°F to 104°F) with 0.7 m/s airflow Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Documentation

Download product documentation and resources

Product Datasheet

SYS-E300-13AD Datasheet

Custom Configurations

Looking for more configuration options or custom setups? Our team can help you find the right solution based on your requirements.

Bulk Purchase Support

Need multiple devices for your business or project? Contact us to discuss bulk pricing, availability, and delivery options.

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SYS-E300-13AD

Details that matter

13th/12th Gen Intel® Core™ (LGA-1700)

Intel® Q670E Chipset

Up to 64GB DDR4-3200 Memory

M.2 M/E-Key & PCIe 5.0 x16 Slot

AMT vPro Supported

Up to 2x 2.5" Drive Bays (Optional)

Quad Independent Displays

Key Applications

Technical Specifications

Documentation

Product Datasheet

Custom Configurations

Bulk Purchase Support

Similar Products

SYS-E300-13AD5

AS-E300-14GR

SYS-E300-14AR

Call a Specialist
Today!

Speak to an Expert

SYS-E300-13AD

Details that matter

13th/12th Gen Intel® Core™ (LGA-1700)

Intel® Q670E Chipset

Up to 64GB DDR4-3200 Memory

M.2 M/E-Key & PCIe 5.0 x16 Slot

AMT vPro Supported

Up to 2x 2.5" Drive Bays (Optional)

Quad Independent Displays

Key Applications

Technical Specifications

Documentation

Product Datasheet

Custom Configurations

Bulk Purchase Support

Similar Products

SYS-E300-13AD5

AS-E300-14GR

SYS-E300-14AR

Call a Specialist Today!

Speak to an Expert

Call a Specialist
Today!