SYS-222HE-FTN

Details that matter

Engineered for professionals who demand the best in performance, security, and design.

Intel® Xeon® 6700/6500 Series

Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores

Up to 8TB Memory in 32 DIMM Slots

32 DIMM slots supporting up to 8TB of memory

Up to 8 PCIe 5.0 Slots for Double-Width GPUs

Optional PCIe slot configurations up to 8 PCIe 5.0 x8 (6FHFL + 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL + 1 FHHL) slots with support for double-width GPU/Accelerator cards

Up to 2 AIOM Slots (OCP NIC 3.0)

Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)

6 Rear Hot-swap 2.5" Bays + M.2 NVMe

6 Rear hot-swap 2.5" NVMe/SAS/SATA drive bays with optional configurations for additional 2 or 4 front hot-swap 2.5" NVMe drive bays (space share with PCIe slots); 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card

Hardware Root of Trust

Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
Supply Chain Security: Remote Attestation
Runtime BMC Protections
System Lockdown

Operating Temperature

Operating Temperature: 10°C to 35°C (50°F to 95°F)

Key Applications

Virtualization, Software-defined Storage, AI Inference and Machine Learning, Cloud Computing, Enterprise Server, 5G Networking

Technical Specifications

Full specifications for the model

SKU	SYS-222HE-FTN
Motherboard	Super X14DBM-SP
Cpu	Dual Socket E2 (LGA-4710) Intel® Xeon® 6700/6500 series processors with P-cores or 6700 series processors with E-cores
Core Count	P-cores: Up to 86C/172T; Up to 336MB Cache per CPU E-cores: Up to 144C/144T; Up to 108MB Cache per CPU
Cpu Note	Supports up to 350W TDP CPUs (Air Cooled) Supports up to 350W TDP CPUs (Liquid Cooled)
Max Gpu Count	Up to 3 double-width or 4 single-width GPUs
Supported Gpu	NVIDIA PCIe: H200 NVL (141GB), L4, L40S, NVIDIA RTX PRO™ 4500 Blackwell Server Edition Intel: Arc™ Pro B50 Graphics, Arc™ Pro B60 Graphics (SW)
Cpu Gpu Interconnect	PCIe 5.0 x16 CPU-to-GPU Interconnect
Gpu Gpu Interconnect	PCIe
Memory	Slot Count: 32 DIMM slots/16 Channels Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM Max Memory (1DPC): Up to 4TB 8800MT/s ECC DDR5 MRDIMM (P-core only) Max Memory (2DPC): Up to 8TB 6000MT/s ECC DDR5 RDIMM
Memory Voltage	1.1V
Nvme	NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
Network Connectivity	Via AIOM
Lan	1 RJ45 1 GbE Dedicated BMC LAN port
Usb	2 USB 3.0 ports (front)
Video	1 VGA port
Bios Type	AMI 64MB SPI Flash
Management Software	SuperCloud Composer® (SCC) Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power Configurations	Power-on mode for AC power recovery ACPI Power Management
Security Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Security Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
Pc Health Cpu	Monitors for CPU Cores, Chipset Voltages, Memory
Pc Health Fan	Fans with tachometer monitoring Pulse Width Modulated (PWM) fan connectors Status monitor for speed control
Pc Health Temperature	Monitoring for CPU and chassis environment Thermal Control for fan connectors
Operating Systems	Oracle Linux 9.4, RHEL 9.4, RHEL 10.0, Windows Server 2022, Windows Server 2025
Form Factor	2U Rackmount
Chassis Model	CSE-HE211-R000NFP
Height	3.5" (88.9 mm)
Width	17.2" (436.88 mm)
Depth	22.6" (574 mm)
Package	9.7" (H) x 23.5" (W) x 36.9" (D)
Weight	Gross Weight: 47.4 lbs (21.5 kg) Net Weight: 34.4 lbs (15.6 kg)
Available Color	Silver
Front Panel Buttons	Power On/Off UID button
Front Panel Led	HDD activity LED LAN1 activity LAN2 activity Power Fail Power status LED System information
Pcie Configuration	Option A* 3 PCIe 5.0 x16 FH/10.5"L double-width slots 1 PCIe 5.0 x16 FHHL slot 2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible) 3 PCIe 5.0 x16 FH/10.5"L double-width slots 1 PCIe 5.0 x16 FHHL slot 2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible) Option B* 6 PCIe 5.0 x8 (in x16) FH/10.5"L slots 2 PCIe 5.0 x8 (in x16) FHHL slots 2 PCIe 5.0 x16 AIOM slots (OCP 3.0 compatible) 6 PCIe 5.0 x8 (in x16) FH/10.5"L slots 2 PCIe 5.0 x8 (in x16) FHHL slots (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
Cxl Support	Up to 4 CXL 2.0 x16/x8 devices
Expansion M 2	2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110)
Drive Bays Configuration	Default: Total 6 bays 6 rear hot-swap 2.5" NVMe/SAS/SATA* drive bays 6 rear hot-swap 2.5" NVMe/SAS/SATA* drive bays Option A: Total 8 bays 6 rear hot-swap 2.5" NVMe/SAS/SATA* drive bays 2 front hot-swap 2.5" NVMe* drive bays 2 front hot-swap 2.5" NVMe* drive bays Option B: Total 10 bays 6 rear hot-swap 2.5" NVMe/SAS/SATA* drive bays 4 front hot-swap 2.5" NVMe* drive bays 4 front hot-swap 2.5" NVMe* drive bays (*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
M 2	2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110/25110)
Fans	Up to 6 counter-rotating 60x60x56mm Fan(s)
Air Shroud	4 Air Shrouds
Liquid Cooling	Direct to Chip (D2C) Cold Plate (optional)
Power Supply Dimension Wxhxl	73.5 x 40 x 203 mm
Power Supply Input	1000W: 100-127Vac / 50-60Hz 1800W: 200-220Vac / 50-60Hz 1980W: 220-230Vac / 50-60Hz 2000W: 230-240Vac / 50-60Hz 2000W: 220-240Vac / 50-60Hz (for UL only) 2000W: 230-240Vdc / 50-60Hz (for China only)
Power Supply 12v	Max: 83A (100Vac-127Vac) Max: 150A (200Vac-220Vac) Max: 165A (220Vac-230Vac) Max: 166A (230Vac-240Vac)
Power Supply 12v Sb	Max: 3.5A
Power Supply Output Type	Backplanes (gold finger)
Power Supply 5v Sb	Max: 4A
Power Supply Dc Input	108.3A Max
Environmental Spec	Operating Temperature: 10°C to 35°C (50°F to 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Documentation

Download product documentation and resources

Product Datasheet

SYS-222HE-FTN Datasheet

Custom Configurations

Looking for more configuration options or custom setups? Our team can help you find the right solution based on your requirements.

Bulk Purchase Support

Need multiple devices for your business or project? Contact us to discuss bulk pricing, availability, and delivery options.

SYS-222HE-FTN

Details that matter

Intel® Xeon® 6700/6500 Series

Up to 8TB Memory in 32 DIMM Slots

Up to 8 PCIe 5.0 Slots for Double-Width GPUs

Up to 2 AIOM Slots (OCP NIC 3.0)

6 Rear Hot-swap 2.5" Bays + M.2 NVMe

Hardware Root of Trust

Operating Temperature

Key Applications

Technical Specifications

Documentation

Product Datasheet

Custom Configurations

Bulk Purchase Support

Similar Products

SYS-222HE-TN

ARS-212HE-FNR

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Call a Specialist
Today!

Speak to an Expert

SYS-222HE-FTN

Details that matter

Intel® Xeon® 6700/6500 Series

Up to 8TB Memory in 32 DIMM Slots

Up to 8 PCIe 5.0 Slots for Double-Width GPUs

Up to 2 AIOM Slots (OCP NIC 3.0)

6 Rear Hot-swap 2.5" Bays + M.2 NVMe

Hardware Root of Trust

Operating Temperature

Key Applications

Technical Specifications

Documentation

Product Datasheet

Custom Configurations

Bulk Purchase Support

Similar Products

SYS-222HE-TN

ARS-212HE-FNR

AS-2115HE-TNR

Call a Specialist Today!

Speak to an Expert

Call a Specialist
Today!