Liquid-Cooled 2 OU NVIDIA HGX™ B300 AI Cluster: 2-OU Liquid-cooled system with front I/O NICs, DPUs, storage, and management.
Engineered for professionals who demand the best in performance, security, and design.
SYS-222GS-NB3OT-ALC
2-OU Liquid-cooled system with front I/O NICs, DPUs, storage, and management
Dual Intel® Xeon® 6700 series processors with P-cores
32 DIMMs, up to 8TB DDR5-5200 or up to 4TB DDR5-6400
NVIDIA HGX B300 8-GPU (288GB HBM3e per GPU*)
1.8TB/s NVLink GPU-GPU interconnect with NVSwitch
5th Generation NVIDIA NVLink at 1.8TB/s
8 integrated NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s
2 dual-port NVIDIA BlueField®-3 DPUs
8 front hot-swap E1.S NVMe drive bays
2 M.2 NVMe slots
Shared power through 4+4 rack power shelves with ORV3 busbar design
Full specifications for the model
| SKU | SYS-222GS-NB3OT-ALC |
|---|---|
| Overview | 2-OU Liquid-cooled system with front I/O NICs, DPUs, storage, and management |
| Cpu | Dual Intel® Xeon® 6700 series processors with P-cores |
| Memory | 32 DIMMs, up to 8TB DDR5-5200 or up to 4TB DDR5-6400 |
| Gpu | NVIDIA HGX B300 8-GPU (288GB HBM3e per GPU*) 1.8TB/s NVLink GPU-GPU interconnect with NVSwitch |
| Nvlink | 5th Generation NVIDIA NVLink at 1.8TB/s |
| Networking | 8 integrated NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s 2 dual-port NVIDIA BlueField®-3 DPUs |
| Storage | 8 front hot-swap E1.S NVMe drive bays 2 M.2 NVMe slots |
| Power Supply | Shared power through 4+4 rack power shelves with ORV3 busbar design |
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